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Heatsink for 2U, 3U chassis (optional): SNK-P0078AP4 Heatsink for 4U/Tower chassis (optional): SNK-P0080AP4 Key Features 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™…
Out of stock
Heatsink for 2U, 3U chassis (optional): SNK-P0078AP4
Heatsink for 4U/Tower chassis (optional): SNK-P0080AP4
Key Features
3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
Intel® C621A
Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz
Up to 2TB Intel® Optane™ Persistent Memory, in 8 DIMM slots
2 PCI-E 4.0 x8,
1 PCI-E 4.0 x16,
1 PCI-E 4.0 x8 (in x16 slot)
3 PCI-E 3.0 x8
M.2 Interface: 1 SATA/PCI-E 3.0 x4
M.2 Form Factor: 2280/22110
M.2 Key: M-Key
Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with Intel® i210 Gigabit Ethernet Controller
Chipset | |
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Socket | |
CPU’s | |
Maximum number of CPUs | |
Form Factor | |
M.2 | |
PCI-Express 4.0 8x | |
PCI-Express 4.0 16x | |
PCI-Express 3.0 8x | |
Memory type | |
Frequency speed | |
Memory features | |
Memory slots | |
15pin D-sub | |
USB 3.2 | |
RJ45 | |
USB 2.0 | |
Integrated LAN | |
RAID | |
Included Accessories | |
Unit Box Width | |
Unit Box Length | |
Unit Box Height | |
Bränd |